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::Nano mould release successful application
Project:
Chip choke coil for a
Japanese MNC
Usage:
Used in LCD
panels, mobile phone and other electronics component
Mold
material: Aluminum
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Problems: Customer
is molding electronic component in the production line.
All molds are required to be oven baked at 200 degree C for
20mins.
The main problem is due to the epoxy content that overflow and hardened
inside the cavities,
Mold release agents are not allow to be used to avoid
contamination on the substrate.
The buildup is extremely difficult to remove after molding.
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Before using Nanomouldrelease
coating
The overall rejects is 3.5%~4%
Production is slow, as after every few cycles require the production
operator to scrub and clean away the epoxy residue before the
next molding process. Extra molds are made in order to maintain the
daily production targets.
Molding cost is very high, as new molds are replaced every 3-5 months
due to the excessive buildup that was beyond repaired.
After
coating with
Nanomouldrelease,
Total rejects is reduce down to 0.2%~0.3%.
Productivity up by 10~15%
Existing molds are re-coated and re-used every 6-8 weeks
No records of new molds made so far after coated.
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